| |
Item |
Mass Production
Capacity |
Pilot Run Production
Capacity |
Layer Counts |
2--24 |
30 |
Material |
FR-4, Aluminum Base |
IS620,BT |
PTFE, PPO/PPE,etc |
Heat sink |
Material Mixed Laminate |
4 layers -- 16 layers |
>16 layers |
Maximum Size |
610mm X 1200mm |
|
Board Outline Tolerance |
±0.13mm |
±0.05mm |
Board Thickness |
0.30mm--7.00mm |
0.2mm--8.00mm |
Thickness Tolerance
( t≥0.8mm) |
±8% |
±5% |
Thickness Tolerance( t<0.8mm) |
±10% |
±8% |
Insulation Layer Thickness |
0.07mm--6.00mm |
0.05mm--0.075mm |
Minimum Line |
0.10mm |
0.075mm |
Minimum Space |
0.10mm |
0.075mm |
Out Layer Copper Thickness |
35um--175um |
35um--210um |
Inner Layer Copper Thickness |
17um--175um |
17um--210um |
Drilling Hole (Mechanical) |
0.20mm--6.35mm |
0.10mm--0.15mm |
Finish Hole (Mechanical) |
0.15mm--6.30mm |
0.00mm--0.10mm |
Diameter Tolerance (Mechanical) |
0.05mm |
|
Registration (Mechanical) |
0.075mm |
0.050mm |
Laser Hole |
0.10mm |
0.075mm |
Aspect Ratio |
10:1 |
12:1;16:1 |
Solder Mask Type |
LPI |
|
SMT Mini. Solder Mask Width |
0.10mm |
0.075mm |
Mini. Solder Mask Clearance |
0.05mm |
0.025mm |
Plug Hole Diameter |
0.25mm--0.60mm |
0.70mm--1.00mm |
Impedance Control Tolerance |
±10% |
±5% |
Surface Finish |
HASL,Flash Gold,ENIG,
Immersion Tin, OSP, |
|
| Immersion Silver, etc |
|
Comment: Pilot Run Production means only sample order or small batch for that kind of production. |